Advanced Automated X-ray Metrology for Wafer-Level and Panel-Level Inspection
Product Description
The XM8000 Series is a cutting-edge, fully automated X-ray metrology platform that redefines defect detection and quality assurance for semiconductor packaging, TSVs, and panel-level devices. Built with NT100M X-ray source, the XM8000 system provides 100 nm feature recognition, exceptional 3D analysis, and the highest throughput in its class.
Designed for inline inspection with unmatched precision and cleanroom compatibility, XM8000 supports devices from MEMS to photonics and wafer panels up to 510 mm × 515 mm. With IC-Safe™ technology, real-time learning, and automated sample handling, XM8000 sets the gold standard for non-destructive, high-resolution metrology in advanced semiconductor manufacturing.
Key Features
- 100 nm defect recognition with NT100M sealed transmissive X-ray source
- 2D, 2.5D, and full 3D analysis for voids, cold joints, bridging, misalignment, and more
- X-ray tube with LaB₆ emitter: 10x brighter than tungsten tubes
- IC-Safe™ radiation protection ensures zero damage to sensitive devices
- AI-powered self-learning algorithms minimize false calls and enhance repeatability
- Up to 30× faster throughput compared to conventional X-ray tools
- ISO Class 3 (at rest) and Class 4 (in motion) cleanroom compliance
- Supports wafers, singulated dies, tape frames, and panel-level packaging
- SECS/GEM integration for automated fab operations
- Fully configurable with 5-axis and 7-axis motion systems
Specification
| Feature | XM8000-5 / XM8000-7 / XM8000-7P |
|---|---|
| X-ray Source | NT100M (sealed transmissive, filament-free) |
| Max Tube Power | 10 W (5/7) / 20 W (7P) |
| Voltage | 30–160 kV |
| Feature Recognition | 100 nm |
| Lifetime | ≥ 5000 X-ray ON hours |
| Detector Type | AspireXL (5), Varex1512 (7/7P) |
| Detector Pitch | 50 µm (5), 75 µm (7/7P) |
| Field of View | Up to 25 mm (5), 12.5 mm (7/7P) |
| Resolution | 0.2 µm to 10 µm per pixel |
| Analysis Capability | 2D, 2.5D (5), 2D/2.5D/3D (7/7P) |
| Cleanroom Compatibility | ISO 3 (stationary), ISO 4 (in motion) |
| IC-Safe Technology | Yes (filters and selective shielding) |
| Motion Axes | 5-axis (5), 7-axis (7/7P) |
| Max Panel Size (7P) | 510 mm × 515 mm, up to 3 kg |
| Automation Interface | SECS/GEM, Ethernet |
| Footprint (Cabinet Only) | 2388 mm × 1895 mm × 2086 mm |
| Weight (With EFEM) | Up to 7062 kg (7P configuration) |
| Power Supply | 200–230 V AC, 50/60 Hz |
| Air Supply | 7–8 bar (20 l/min) |
| Vacuum Requirement | Up to -100 kPa (14.5 psi) / 14 l/min |
| X-ray Leakage | < 1 µSv/h (meets global standards) |
Applications
Semiconductors & Wafer-Level Packaging
- TSV inspection: fill, shape, alignment, voiding
- Wafer bump characterization: presence, position, void, bridging, Head-in-Pillow
- Analysis of MEMS, CIS, RF, FPGA, and photonics devices
- IC-safe testing of highly sensitive chips and devices
Panel-Level Packaging
- In-depth 3D inspection of multi-layer packages
- Panel size up to 510 mm × 515 mm, including warped panels
- Detection of micro-voids and cold joints in advanced panel layouts
Advanced Electronics & Sensors
- Non-destructive metrology of high-reliability electronic assemblies
- Component-level inspection in automotive, medical, and aerospace sectors
- Inline quality assurance with cleanroom-ready integration
R&D and Process Development
- Rapid defect discovery and classification in early-stage design
- Continuous feedback for yield improvement in fabrication
- Custom algorithm development for novel device structures
Resources
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