High-Throughput Plasma FIB-SEM for Semiconductor Failure Analysis

Product Overview
The TESCAN TENSOR is a revolutionary dedicated Scanning Transmission Electron Microscope (STEM) designed to streamline and automate complex electron microscopy workflows. Unlike conventional TEM/STEM systems, TENSOR eliminates the manual alignment, complex optics, and extensive training requirements typically associated with high-end electron microscopy.
Featuring automated setup and alignment, integrated diffraction analysis, and a high-speed direct electron detector, TENSOR enables researchers to go from sample loading to acquiring results within minutes, rather than hours or days. This unprecedented efficiency makes it ideal for materials science, semiconductor research, pharmaceutical development, and nanotechnology applications.
Key Features
- Fully Automated 4D-STEM – User-friendly operation with minimal training required.
- Precession Electron Diffraction (PED) – Accurate crystallographic and phase mapping.
- Integrated High-Speed Direct Electron Detector – Fast data acquisition with high sensitivity.
- Nanobeam Electron Diffraction (NBD) for Strain Mapping – Precise measurement of residual strain at the nanoscale.
- Automated Data Acquisition & Analysis – Built-in software for real-time diffraction imaging.
- Application-Driven Design – Developed specifically for 4D-STEM applications in materials science.
- Parallel Data Processing – Real-time strain mapping, orientation mapping, and phase identification.
- Compact Design with Reduced Complexity – No traditional TEM/STEM alignment headaches.
- Upside-Down Electron Column Design – Optimized for automation and stability.
Specifications
| Feature | Specification |
|---|---|
| Electron Source | Schottky Field Emission Gun (FEG) |
| Imaging Mode | Dedicated Scanning Transmission Electron Microscope (STEM) |
| Precession Electron Diffraction (PED) | Fully integrated |
| 4D-STEM Capability | Yes, with automated data acquisition & analysis |
| Detector | High-Speed Direct Electron Detector |
| Resolution | Sub-Angstrom imaging |
| Strain Mapping & Orientation Mapping | Yes, real-time data processing |
| Software | TESCAN Essence™ with AI-driven automation |
| Column Design | Upside-down electron column for stability & efficiency |
| Ease of Use | Fully automated, minimal user training required |
Applications
- Crystallographic Orientation & Defect Analysis – 4D-STEM with PED provides precise structural data.
- Nanoparticle & Thin Film Characterization – Determine grain structure, phase distributions, and defects.
- Strain Mapping & Lattice Parameter Measurements – High-precision strain analysis in semiconductor materials.
- Failure Analysis & Device Inspection – Analyze defects in semiconductor materials at the atomic level.
- Wafer-Level Strain & Orientation Mapping – Identify mechanical stress in integrated circuits.
- Sub-Angstrom Resolution Imaging – Resolve atomic structures in transistors, interconnects, and MEMS.
- Drug Nanoparticle Characterization – Examine molecular structures and phase transitions.
- Bio-Material & Soft Matter Imaging – Analyze polymers, proteins, and organic nanomaterials.
- 4D-STEM for Live Cell & Cryo-EM Applications – Correlative electron microscopy for biological research.
- Ore & Mineral Phase Identification – Determine crystallographic structures in geological samples.
- High-Resolution Mapping of Elemental Distributions – Analyze mineral compositions at the nanoscale.
- Precession Electron Diffraction for Structural Studies – Improve accuracy of mineralogical analysis.
Resources
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