High-Resolution, Room-Temperature 3D Topography Measurement
Product Overview
The RT-3D Sensor is a flexible, high-precision 3D measurement system designed for detailed analysis of surface topography and deformation in materials and components at room temperature. Utilizing advanced phase-shifting projection moiré technology, it delivers high-resolution, full-field 3D topography measurements with submicron accuracy.
Engineered for applications in process development, failure analysis, reliability testing, and quality control, the RT-3D Sensor accommodates samples ranging from 0.5 x 0.5 mm up to 1000 x 1000 mm. Its modular design and intuitive software interface make it an indispensable tool for industries requiring precise thermal-mechanical characterization.
Key Features
- Non-contact, full-field 3D measurement using phase-shifting projection moiré technology
- High-resolution 12-megapixel CCD camera for detailed topography analysis
- Sample size flexibility: from 0.5 x 0.5 mm up to 1000 x 1000 mm
- Adjustable field of view (X, Y): from 20 x 24 mm to 640 x 470 mm
- Depth of view (Z): up to 40 mm
- High measurement accuracy: 1 µm or 2% of measured value
- Room temperature operation: suitable for various laboratory environments
Specifications
| Feature | Specification |
|---|---|
| Measurement Technology | Phase-shifting projection moiré |
| Camera Resolution | 12 megapixels |
| Field of View (X, Y) | 20 x 24 mm to 640 x 470 mm |
| Depth of View (Z) | Up to 40 mm |
| Sample Size Range | 0.5 x 0.5 mm to 1000 x 1000 mm |
| Accuracy | 1 µm or 2% of measured value |
| Operating Temperature | Room temperature |
Applications
Semiconductor & Electronics
- Warpage analysis during reflow soldering processes
- Reliability testing of electronic components under thermal cycling
- Failure analysis of printed circuit boards (PCBs) and semiconductor packages
Manufacturing & Quality Assurance
- Inline quality control for components sensitive to thermal variations
- Process development for materials requiring precise thermal management
Materials Science & Research
- Study of thermal-induced deformation in novel materials
- Research on thermal expansion coefficients and material behaviors
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