Advanced 3D Warpage and Deformation Measurement for Large-Scale Components
Product Overview
The TDM Compact 3-XL is a high-precision, non-contact 3D measurement system designed to analyze warpage and deformation of large-scale materials and components under thermal stress. Utilizing advanced phase-shifting projection moiré technology, it delivers high-resolution, full-field 3D topography measurements with submicron accuracy.
Engineered for applications in process development, failure analysis, reliability testing, and quality control, the TDM Compact 3-XL accommodates samples up to 800 x 600 mm and operates across a wide temperature range. Its modular design, rapid thermal cycling capabilities, and intuitive software interface make it an indispensable tool for industries requiring precise thermal-mechanical characterization.
Key Features
- Non-contact, full-field 3D measurement using phase-shifting projection moiré technology
- High-resolution 12-megapixel CCD camera for detailed topography analysis
- Large sample accommodation: up to 800 x 600 mm
- Adjustable field of view (X, Y): from 20 x 24 mm to 640 x 470 mm
- Depth of view (Z): up to 40 mm
- High measurement accuracy: 1 µm or 2% of measured value
- Independent top and bottom heating with rapid thermal cycling
- User-friendly software with automatic post-processing and compliance with industry standards
- Compact footprint: 300 x 120 x 198 cm, suitable for various laboratory environments
Specifications
| Feature | Specification |
|---|---|
| Measurement Technology | Phase-shifting projection moiré |
| Camera Resolution | 12 megapixels |
| Field of View (X, Y) | Adjustable from 20 x 24 mm to 640 x 470 mm |
| Depth of View (Z) | Up to 40 mm |
| Maximum Sample Size | 800 x 600 mm |
| Accuracy | 1 µm or 2% of measured value |
| Temperature Range | -65°C to 400°C |
| Heating Rate | Up to +1.5°C/s |
| Cooling Rate | Up to -1.5°C/s |
| Footprint (W x H x D) | 300 x 120 x 198 cm |
Applications
Semiconductor & Electronics
- Warpage analysis during reflow soldering processes
- Reliability testing of electronic components under thermal cycling
- Failure analysis of printed circuit boards (PCBs) and semiconductor packages
Manufacturing & Quality Assurance
- Inline quality control for components sensitive to thermal variations
- Process development for materials requiring precise thermal management
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