Precision 3D Warpage and Deformation Measurement System
Product Overview
The TDM Compact 3 is a non-contact 3D measurement system designed to analyze warpage and deformation of materials and components under thermal stress. Utilizing advanced phase-shifting projection moiré technology, it delivers high-resolution, full-field 3D topography measurements with submicron accuracy.
Engineered for applications in process development, failure analysis, reliability testing, and quality control, the TDM Compact 3 accommodates samples up to 400 x 700 mm and operates across a wide temperature range from -65°C to 400°C. Its modular design, rapid thermal cycling capabilities, and intuitive software interface make it an indispensable tool for industries requiring precise thermal-mechanical characterization.
Key Features
- Non-contact, full-field 3D measurement using phase-shifting projection moiré technology
- High-resolution 12-megapixel CCD camera for detailed topography analysis
- Wide temperature range: -65°C to 400°C with independent top and bottom heating
- Rapid thermal cycling: heating rates up to +6°C/s and cooling rates up to -3°C/s
- Large sample accommodation: up to 400 x 700 mm
- High measurement accuracy: <1 µm or 2% of measured value
- User-friendly software with automatic post-processing and compliance with industry standards
- Compact footprint: 260 x 97 x 199 cm, suitable for various laboratory environments
Specifications
| Feature | Specification |
|---|---|
| Measurement Technology | Phase-shifting projection moiré |
| Camera Resolution | 12 megapixels |
| Field of View (X, Y) | 300 mm x 375 mm |
| Depth of View (Z) | 40 mm |
| Maximum Sample Size | 400 mm x 700 mm |
| Accuracy | <1 µm or 2% of measured value |
| Temperature Range | -65°C to 400°C |
| Heating Rate | Up to +6°C/s |
| Cooling Rate | Up to -3°C/s |
| Footprint (W x H x D) | 260 cm x 97 cm x 199 cm |
Applications
Semiconductor & Electronics
- Warpage analysis during reflow soldering processes
- Reliability testing of electronic components under thermal cycling
- Failure analysis of printed circuit boards (PCBs) and semiconductor packages
Manufacturing & Quality Assurance
- Inline quality control for components sensitive to thermal variations
- Process development for materials requiring precise thermal management
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