Modular 3D Warpage and Deformation Measurement System
Product Overview
The TDM Compact 2 is a versatile, modular, and high-precision 3D measurement system designed to analyze warpage and deformation of materials and components under thermal stress. Utilizing advanced phase-shifting projection moiré technology, it delivers high-resolution, full-field 3D topography measurements with submicron accuracy.
Engineered for applications in process development, failure analysis, reliability testing, and quality control, the TDM Compact 2 accommodates samples up to 200 x 200 mm and operates across a temperature range from room temperature to 300°C. Its modular design, rapid thermal cycling capabilities, and intuitive software interface make it an indispensable tool for industries requiring precise thermal-mechanical characterization.
Key Features
- Non-contact, full-field 3D measurement using phase-shifting projection moiré technology
- High-resolution 12-megapixel CCD camera for detailed topography analysis
- Temperature range: Room temperature to 300°C with independently controlled top and bottom heating
- Rapid thermal cycling: Heating rates up to +3°C/s and cooling rates up to -2°C/s
- Maximum sample size: 200 x 200 mm
- Field of view (X, Y): 10 x 12 mm to 150 x 187 mm
- Depth of view (Z): Up to 25 mm
- High measurement accuracy: <1 µm or 2% of measured value
- Compact footprint: 126 x 70 x 195 cm, suitable for various laboratory environments
Specifications
| Feature | Specification |
|---|---|
| Measurement Technology | Phase-shifting projection moiré |
| Camera Resolution | 12 megapixels |
| Field of View (X, Y) | 10 x 12 mm to 150 x 187 mm |
| Depth of View (Z) | Up to 25 mm |
| Maximum Sample Size | 200 x 200 mm |
| Accuracy | <1 µm or 2% of measured value |
| Temperature Range | Room temperature to 300°C |
| Heating Rate | Up to +3°C/s |
| Cooling Rate | Up to -2°C/s |
| Footprint (W x H x D) | 126 x 70 x 195 cm |
Applications
Semiconductor & Electronics
- Warpage analysis during reflow soldering processes
- Reliability testing of electronic components under thermal cycling
- Failure analysis of printed circuit boards (PCBs) and semiconductor packages
Manufacturing & Quality Assurance
- Inline quality control for components sensitive to thermal variations
- Process development for materials requiring precise thermal management
Materials Science & Research
- Study of thermal-induced deformation in novel materials
- Research on thermal expansion coefficients and material behaviors
Please complete the form and we will be in contact as soon as possible.