Precision Bond Testing Platform for Semiconductor & Microelectronics Manufacturing
The STELLAR 4000 is an industry-leading, high-precision bond testing system engineered for production environments requiring uncompromising accuracy and system-to-system repeatability. Supporting a wide range of manual bond testing modes—including wire pull, die shear, ball shear, tweezer pull, and bump testing—the STELLAR 4000 is designed for semiconductor packaging, advanced electronics, and component reliability validation.
With intuitive Paragon™ Lite software, ergonomic operator controls, and a cleanroom-ready enclosed design, the STELLAR 4000 ensures unmatched ease of use and data consistency. Built with Nordson’s patented frictionless load cartridge technology, it guarantees long-term accuracy, rugged durability, and full compliance with major international testing standards.
Key Features
- Multi-mode bond testing: wire pull, die shear, ball shear, tweezer pull, bump pull
- Frictionless load cartridge technology for unmatched repeatability and accuracy
- Fully enclosed, cleanroom-friendly design meeting SEMI S2 & S8 standards
- User-centric ergonomics: padded armrests, dimmable lighting, and antivibration optics
- Paragon™ Lite software for fast setup and operator-friendly testing workflows
- High accuracy: ±0.25% FSL system accuracy; ±1 µm step-back accuracy
- Fast axis control: XY and Z speeds up to 2 mm/s and 5 mm/s, sub-micron resolution
- CE compliant with RoHS, ISO 9001:2015 accreditation
- Fully compatible with Nordson DAGE 4000 series test cartridges
Specifications
| Feature | Specification |
|---|---|
| Test Modes | Wire pull, ball shear, die shear, bump pull, tweezer pull |
| Accuracy (System) | ±0.25% FSL |
| Step-back Accuracy | ±1 µm |
| Axis Travel (X × Y × Z) | 100 mm × 100 mm × 65 mm |
| XY Speed / Resolution | Up to 2 mm/s, 500 nm |
| Z Speed / Resolution | 5 mm/s, 250 nm |
| Software | Paragon™ Lite |
| PC Connection | Ethernet |
| Lighting | Software-controlled dimmable LED |
| Table Type | Integrated and enclosed |
| Footprint (W × D × H) | 705 mm × 562 mm × 675 mm |
| Weight | 86 kg |
| Power Supply | 100–240 VAC single phase |
| Air Supply | Minimum 4.0 bar |
| Certifications | SEMI S2 & S8, CE (Machinery, EMC, RoHS), ISO 9001:2015 |
Applications
Semiconductors
- Pull and shear testing for wire bonds, ball bonds, and bump interconnects in wafer-level and advanced packaging
- Qualification and reliability testing for flip-chip, wafer-level packaging (WLP), fan-out, and system-in-package (SiP) devices
- Depth-accurate die shear testing for stacked dies and multi-chip modules
- Conformance to international semiconductor reliability standards (MIL-STD, JEDEC, IPC)
Electrical & Electronics
- Bond strength testing of PCB-mounted components, sensors, and connectors
- Evaluation of solder joints, leadframes, and metal-to-substrate bonds
- Quality assurance of power electronics, automotive control modules, and high-reliability consumer electronics
- Lifecycle testing to assess mechanical integrity under environmental or vibration stress conditions
Resources
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