Next-Generation Inspection, Measurement, and Metrology Powered by MRS Technology
Product Overview
The SQ3000 is a powerful, all-in-one multi-function inspection platform that integrates 3D Automated Optical Inspection (AOI), Solder Paste Inspection (SPI), and Coordinate Measurement Machine (CMM) capabilities in a single in-line solution. Powered by revolutionary Multi-Reflection Suppression (MRS) sensor technology, the SQ3000 delivers metrology-grade accuracy at production speed, making it ideal for high-volume SMT, semiconductor, and advanced packaging applications.
Designed for the industry’s most demanding inspection and measurement requirements, the SQ3000’s AI2 (Autonomous Image Interpretation) software, CyberCMM suite, and CyberReport SPC tools enable fast programming, precise defect identification, and real-time analytics. Available in standard and SQ3000-X large-board configurations, the system supports dual-lane, dual-sensor, and high-speed options for maximum flexibility.
Key Features
- AOI, SPI & CMM integrated in one inline platform
- Powered by Multi-Reflection Suppression (MRS) sensor for distortion-free inspection
- Up to sub-10 µm 3D resolution with ultra-high accuracy
- AI2 software enables setup in <13 minutes using automated model creation
- CyberCMM suite provides true metrology-grade coordinate measurements
- Large board support up to 710 × 610 mm (SQ3000-X model)
- Flexible MRS sensor options for speed, resolution, or accuracy optimization
- SPC-ready with CyberReport for real-time yield tracking and analytics
- Detects solder defects, lifted leads, co-planarity issues, component presence, polarity, and more
- Supports tight-tolerance 0201 and 01005 components and microelectronics inspection
- Available in dual-lane (SQ3000-D) and dual-sensor (SQ3000-DD) configurations
Specifications
| Feature | Specification |
|---|---|
| Inspection Capabilities | 3D AOI, SPI, and CMM in-line |
| Sensor Technology | Multi-Reflection Suppression® (MRS®) |
| Resolution Options | Standard, High-Speed, High-Res, Ultra-High-Res (sub-10 µm) |
| Inspection Speed (2D+3D) | Up to 50 cm²/sec |
| Minimum Component Size | 0201 mm (008004 in.) |
| PCB Size (Standard) | 50 × 50 mm to 510 × 510 mm |
| PCB Size (SQ3000-X) | 50 × 120 mm to 710 × 610 mm |
| Component Height Clearance | Top: 50 mm, Bottom: 30 mm |
| Z Height Accuracy | 1 µm on certification target |
| CMM XY / Z Accuracy | Up to 5 µm / 2 µm |
| Programming Time | <13 minutes with AI2 |
| Software Suites | AI2™, CyberCMM™, CyberReport™ |
| System Interface | SMEMA, RS232, Ethernet |
| Power Requirement | 100–240 VAC, 50/60 Hz, 10–15 A |
| Air Requirement | 80–100 psi @ 4 CFM |
| System Dimensions | SQ3000: 110 × 127 × 139 cm / SQ3000-X: 134 × 139 × 139 cm |
| System Weight | SQ3000: 965 kg / SQ3000-X: 1242 kg |
Applications
Semiconductors & Advanced Packaging
- Microbump, flip chip, and BGA co-planarity inspection
- SPI/CMM on 0201 and 01005 packages
- Chiplet and fan-out wafer-level package (FOWLP) metrology
Automotive Electronics
- High-speed 3D inspection of ADAS modules, ECUs, and high-reliability PCBs
- Conformal coating presence and goldfinger contamination detection
SMT Electronics
- 3D inspection for solder joint quality, placement accuracy, bridging, polarity
- Complete SPI and AOI for high-mix, high-volume SMT lines
Resources
Download SQ3000 Datasheet
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