High-Resolution X-ray Imaging for Large Board and High-Precision Applications
Product Description
The Ruby XL X-ray Inspection System is purpose-built to deliver sub-micron feature recognition, large-area inspection, and ultra-high resolution for electronics failure analysis and in-line manufacturing tasks. Equipped with a sealed-transmissive MK4 X-ray tube, 3 MP flat panel detector, and Nordson’s exclusive X-Plane imaging technology, the Ruby XL offers a unique combination of performance, simplicity, and stability.
Designed with production in mind, its isocentric manipulator, oblique viewing at 70°, and point-and-click operation allow users to conduct automated or manual inspections without programming experience. The system supports crystal-clear imaging at high magnification (up to 1800x), even on large PCBs up to 33" × 24".
Key Features
- Sub-micron resolution with < 0.5 µm feature recognition
- MK4 sealed-transmissive X-ray tube – maintenance-free with 20 W target power
- 3 MP CMOS flat panel detector with real-time image enhancement
- X-Plane® technology for layered image slicing without additional CT hardware
- 1800x geometric magnification with 70° oblique angle viewing
- AXiS anti-vibration stabilization for steady imaging in any environment
- Joystick-free, point-and-click operation – minimal training required
- Automated inspection routines with no programming required
- Large tray size – supports boards up to 840 × 615 mm (33" × 24.2")
- Dual 24” monitors and Gensys software for intuitive imaging control
Specification
| Feature | Specification |
|---|---|
| X-ray Tube | MK4 sealed-transmissive, filament-free |
| Tube Voltage | 30–160 kV |
| Max Target Power | 20 W |
| Feature Recognition | < 0.5 µm |
| Detector Type | 3 MP CMOS flat panel |
| Frame Rate | 25 fps |
| Inspection Area | 840 × 615 mm (33” × 24.2”) |
| Max Sample Weight | 10 kg (22 lbs) |
| Magnification | Geometric up to 1800× |
| Oblique Viewing | 70° at 360° rotation (isocentric) |
| Software | Gensys with X-Plane® and AXiS stabilization |
| Display | Dual 24” TFT LCD monitors |
| Footprint (W × D × H) | 2749 × 2490 × 2070 mm |
| System Weight | ~3000 kg (6600 lbs) |
| Power Supply | 200–230 V AC, 16 A (single phase) |
| Air Supply | 4–6 bar clean dry air |
| Operation Temperature | 10–30 °C |
| Humidity | < 85% (non-condensing) |
| Radiation Safety | < 1 µSv/h (meets international standards) |
Applications
Semiconductors & Microelectronics
- Inspection of micro solder joints, µ-bumps, and flip chips
- High-magnification failure analysis of wire bonds, vias, and interconnects
PCB Assembly & SMT
- Large board inspection up to 33” × 24” for multilayer and high-density assemblies
- Automated inspection of BGA, QFN, CSP, and void detection
- Solder paste and reflow defect detection in high-throughput lines
Resources
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