Next-Generation Inspection, Measurement, and Metrology Powered by MRS Technology
Product Overview
🟦 QX600 – Ultra-Fast, Ultra-Precise AOI
The QX600 delivers best-in-class 01005 component and solder joint inspection performance using a 12 µm resolution and a high-speed 80 MP sensor per module. Ideal for high-volume SMT production, it offers flexible configurations including dual-lane (QX600-D) and large board support (QX600-L), all powered by Nordson’s advanced AI2 (Autonomous Image Interpretation) for rapid programming and ultra-low false calls.
Key Features
- Dual-lane and large board models (QX600-D, QX600-L)
- 12 µm resolution with 80 MP sensor per SIM module
- Fast inspection with calibration-free SIM lighting
- AI2 software enables setup in <13 minutes
- 01005 inspection & solder joint defect detection
- Smart pixel marking for rapid defect verification
- SMEMA, RS232, Ethernet interfaces
- Factory, line, and machine-level SPC with CyberReport
🟩 QX250i™ – High-Value AOI with Flexibility for All Applications
The QX250i offers a cost-effective 2D AOI solution optimized for pre-reflow and selective solder inspection, with support for top and bottom inspection using dual SIMs. Powered by AI2, it provides rapid programming, superior accuracy, and is ideal for high-mix or low-volume lines. It features an 80 MP sensor and a 12 µm resolution, matching QX600 in visual clarity with simplified line integration.
Key Features
- Dual SIMs for top and bottom inspection
- Best-in-class inspection of 01005 components
- AI2™ technology for minimal false calls and easy programming
- Fast programming in <13 minutes
- 12 µm resolution with strobe white lighting
- Ideal for selective solder & pre-reflow AOI
- Statistical Appearance Modeling (SAM™) compatible
- Compact footprint and quick installation (<1 hour)
Specification
| Specification | QX600 | QX250i |
|---|---|---|
| Sensor Resolution | 80 MP, 12 µm | 80 MP, 12 µm |
| Inspection Speed | Up to 110 cm²/sec | Up to 110 cm²/sec |
| Minimum Component Size | 01005 | 01005 |
| Max Board Size | 590 × 510 mm (QX600-L) | 400 × 308 mm |
| Top/Bottom Clearance | Top: 35 mm / Bottom: 34 mm | Top: 35 mm / Bottom: 34 mm |
| Board Warp Tolerance | ±7 mm | ±7 mm |
| Defect Types Detected | Opens, bridges, tombstones, etc. | Bridges, floating pins, voids |
| Lighting System | SIM with white strobe LED | SIM with white strobe LED |
| Image Processing | SAM™ / AI2 | SAM™ / AI2 |
| Programming Time | <13 minutes | <13 minutes |
| SPC Software | CyberReport | CyberReport |
| Power Requirement | 100–240 V, 50/60 Hz | 100–240 V, 50/60 Hz |
| System Dimensions | 1000 × 1047 × 1240 mm | 1000 × 1047 × 1240 mm |
| Machine Weight | ~249 kg | ~249 kg |
| Installation Time | <1 hour | <1 hour |
Applications
Consumer & Mobile Electronics
- QX600: High-speed inspection for ultra-dense smartphone and wearable boards
- QX250i: Efficient inspection for selective solder joints and pre-reflow stages
Automotive Electronics
- QX600: Dual-lane processing for ADAS, infotainment, and ECU assemblies
- QX250i: Mid-volume production with full SMT & THT component support
Industrial & Power Electronics
- QX600: Large-format board inspection with dual-lane efficiency
- QX250i: Cost-effective solution for ruggedized PCB quality assurance
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