Semi-Automated Wafer Metrology System
Product Overview
The Proforma 300iSA is a semi-automated wafer measurement system designed for high-precision, non-contact measurement of semiconductor and semi-insulating wafers. Utilizing unique Push-Pull™ capacitance probe technology, the system provides full wafer surface scanning for thickness, total thickness variation (TTV), bow, warp, site, and global flatness.
This Windows-based system allows for user-defined and ASTM/SEMI-compliant scanning patterns, generating detailed 3D wafer mapping for in-depth analysis. Its customizable reporting, remote access capabilities, and full data export options make it a versatile tool for wafer manufacturing, quality control, and research applications.
Key Features
- Non-Contact Full Wafer Scanning – Preserves wafer integrity while ensuring precise measurements.
- 3D Mapping of Wafer Thickness & Shape – Provides detailed topography for process optimization.
- Push-Pull™ Capacitance Probe Technology – Allows accurate measurement of semi-conductive and semi-insulating wafers.
- Upgradeable to Fully Automated System – Provides scalability for future needs.
- Standard Windows-Based Interface – User-friendly controls with remote data access.
- Customizable Data Reporting & Export – Compatible with spreadsheets and word-processing programs.
- Supports Multiple Wafer Sizes – Accommodates wafers from 75 mm to 300 mm.
- High Measurement Accuracy & Repeatability – Ensures compliance with semiconductor manufacturing standards.
Specifications
| Feature | Standard Range |
|---|---|
| Thickness (ASTM F533) | ±0.25 µm accuracy |
| TTV (ASTM F533) | ±0.25 µm accuracy |
| Bow (ASTM F534) | ±500 µm range, ±2.0 µm accuracy |
| Warp (ASTM F1390) | ±500 µm range, ±2.0 µm accuracy |
| Global & Site Flatness (ASTM F1530) | ±0.05 µm accuracy |
| Wafer Diameters Supported | 75 mm, 150 mm, 200 mm, 300 mm |
| Measurement Materials | Si, GaAs, Ge, SiC, InP |
| Surface Types | As-cut, lapped, etched, polished, patterned |
Applications
- Wafer Thickness & Uniformity Measurement – Critical for process control in IC fabrication.
- Total Thickness Variation (TTV) Analysis – Ensures planarization and uniform material deposition.
- Bow, Warp & Sori Characterization – Evaluates wafer stress and deformation.
- Flatness & Surface Profiling – Ideal for advanced material development and research applications.
- Measurement of Semi-Insulating & Semi-Conducting Wafers – Supports Si, GaAs, Ge, SiC, and InP substrates.
- Inspection of As-Cut, Lapped, Etched, Polished, & Patterned Wafers – Versatile metrology for various production stages.
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