High-Precision Manual Wafer Measurement System
Product Overview
The Proforma 300i is a manual wafer metrology system designed for accurate and repeatable measurement of wafer thickness, total thickness variation (TTV), and bow. Utilizing non-contact capacitance probe technology, the Proforma 300i provides a cost-effective alternative to fully automated wafer inspection systems, making it ideal for semiconductor, material science, and research applications.
With support for wafers ranging from 76 mm to 300 mm in diameter, this system offers high-resolution, real-time measurements through a user-friendly, menu-driven interface with USB data storage and remote access capabilities.
Key Features
- Non-Contact Measurement – Capacitive sensing technology ensures high precision without physical wafer contact.
- Broad Wafer Compatibility – Supports semiconductor and semi-insulating materials such as Si, GaAs, Ge, and InP.
- High Measurement Accuracy – Delivers ±0.25 µm accuracy with a resolution of 0.05 µm.
- TTV & Bow Measurement – Provides critical wafer profile data for process monitoring.
- Menu-Driven Interface – Simple, user-friendly LCD interface for fast and efficient operation.
- USB Data Storage & Remote Access – Save measurements directly to a USB flash drive or connect via Ethernet.
- Compact & Portable Design – Lightweight system for easy integration into laboratories and production environments.
Specifications
| Feature | Specification |
|---|---|
| Wafer Size Compatibility | 76 mm – 300 mm |
| Measurement Range | Up to 1700 µm |
| Accuracy | ±0.25 µm |
| Resolution | 0.05 µm |
| Response Time | 60 ms |
| Measurement Materials | Si, GaAs, Ge, InP |
| Interface Options | RS232, Ethernet, USB |
| Display | High-Resolution LCD |
| Power Requirements | 100 – 240V AC, 50 – 60 Hz |
| Operational Temperature | 15°C – 40°C |
| System Dimensions (L x W x H) | 482 mm x 330 mm x 279 mm |
| Weight | 12.3 kg |
Applications
- Wafer Thickness Measurement – Ensures process consistency and material uniformity.
- Total Thickness Variation (TTV) Analysis – Helps optimize wafer planarization processes.
- Bow & Warp Measurement – Essential for evaluating wafer stress and curvature.
- Characterization of Semiconductor Wafers – Supports research on Si, GaAs, Ge, InP, and other materials.
- Thin-Film & Coating Studies – Analyzes substrate integrity and uniformity.
- Substrate Inspection for Microelectronics – Provides critical dimensional data for MEMS and IC fabrication.
- Process Development & Failure Analysis – Supports quality assurance and defect detection.
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