PHI 710 Auger Electron Spectroscopy

Product Overview
The PHI 710 Scanning Auger Nanoprobe is a high-performance Auger Electron Spectroscopy (AES) instrument designed to provide elemental and chemical state information from sample surfaces, nano-scale features, thin films, and interfaces. It offers superior Auger imaging performance, spatial resolution, sensitivity, and spectral energy resolution, making it suitable for demanding AES applications.
Key Features
- High Spatial Resolution: Achieves SEM resolution ≤ 3 nm and AES resolution ≤ 8 nm, enabling detailed analysis of nano-scale features.
- Acoustic Enclosure Box: Minimizes the effects of vibration, sound, and temperature changes, allowing Auger analysis at magnifications up to 500,000× under low-drift conditions.
- Coaxial Cylindrical Mirror Analyzer (CMA): PHI's unique electron spectrometer design captures Auger electrons emitted in 360 degrees from the sample, providing high sensitivity and reducing the impact of sample shape or tilt angle.
- Chemical State Mapping: Spectrum mapping capability maintains the spectrum for each pixel, enabling chemical state mapping images based on spectral analysis.
- Versatile Sample Support: Capable of analyzing various sample shapes without shadow effects, ensuring accurate understanding of the sample.
Specifications
| Specification | Details |
|---|---|
| SEM Spatial Resolution | ≤ 3 nm |
| AES Spatial Resolution | ≤ 8 nm (@ 20 kV, 1 nA) |
| Maximum Magnification | Up to 500,000× |
| Analyzer Type | Coaxial Cylindrical Mirror Analyzer (CMA) |
| Chemical State Mapping | Spectrum mapping with per-pixel spectral data |
| Sample Compatibility | Supports various shapes without shadow effects |
| Environmental Control | Acoustic enclosure minimizes vibration, sound, and temperature fluctuations |
| Software Platform | SmartSoft-AES with MultiPak Data Reduction Software |
Applications
- Nano-scale Surface Analysis: Ideal for analyzing small features, inclusions, and grain boundaries in materials like ductile cast iron.
- Thin Film and Interface Characterization: Provides detailed information on thin films and interfaces in semiconductor devices.
- Chemical State Mapping: Enables chemical state mapping of elements such as silicon in semiconductor chips, distinguishing between elemental Si, Si oxynitride, and metal silicide.
- Versatile Material Analysis: Suitable for a wide range of materials, including metals, polymers, and ceramics, due to its high sensitivity and spatial resolution.
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