March FlexTrak SHS Plasma Treatment System
Product Overview
The March FlexTrak SHS Plasma Treatment System from Nordson is an advanced, flexible, and cost-effective solution for surface modification of a wide range of materials. With its superior plasma treatment technology, this system enhances surface properties, ensuring optimal bonding, coating, and adhesion for various electronic applications. Whether for PCB cleaning, wire bonding, or conformal coating, the March FlexTrak SHS offers highly efficient, repeatable, and precise plasma treatment solutions.
Key Features
- Flexible, Modular Design: The March FlexTrak SHS system is designed with versatility in mind. It can easily be configured to meet the specific needs of your production line, accommodating various substrates and process requirements.
- Superior Plasma Technology: Delivers uniform plasma treatment across the surface, improving adhesion, wettability, and cleanliness. Plasma treatment is effective for a wide range of materials including metals, plastics, and composites.
- Automated Process Control: Features a fully automated process control system with a user-friendly interface that minimizes operator errors, reduces cycle times, and ensures repeatable results. Programmable recipes allow for tailored treatments based on material properties and application requirements.
- Environmentally Friendly: The system uses a dry process, avoiding the use of harmful chemicals. It significantly reduces waste, making it an eco-friendly alternative to traditional surface treatment methods.
- Compact Footprint: The March FlexTrak SHS is designed to be space-efficient, making it ideal for environments where space is limited but performance cannot be compromised.
- High Throughput: The system offers high throughput processing, making it ideal for medium to high-volume production environments, enabling manufacturers to meet demanding production schedules with ease.
Specifications
| Feature | Specification |
|---|---|
| Chamber Volume | F3-S chamber: 9.6 liters (585 in³) F3 chamber: 5.5 liters (338 in³) |
| Powered Electrode Dimensions | F3-S chamber: 305 W x 610 D mm / 12 W x 24 D in F3 chamber: 305 W x 305 D mm / 12 W x 12 D in |
| RF Power Wattage | 13.56 MHz |
| RF Power Frequency | SMD (Surface Mount Devices), Through-Hole Components, and other PCB components |
| Vacuum Pump | Standard Purged Dry Pump, 16 CFM, Variable Frequency Drive |
| Remote Interface | SECS/GEM, Remote HMI |
| Gas Control | Maximum Number of MFCs : 3 |
| System Dimensions (L x W x H) | 2,314mm x 1,935mm x 1,787mm |
| Weight | 1505 kg (approx.) |
Applications
- Electronics Manufacturing: Surface preparation for PCB assembly, wire bonding, and encapsulation.
- Medical Devices: Enhancing adhesion for coatings and bonding in medical equipment production.
- Automotive: Improving paint adhesion and surface activation for automotive components.
- Packaging: Surface treatment for improved printability and adhesion in packaging materials.
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