Jade Plus X-ray Inspection System
Product Description
The Jade Plus is a high-resolution, operator-friendly manual X-ray inspection system built to deliver fast and accurate defect detection for electronics manufacturing, PCB assembly, and micro-component quality assurance. Equipped with a 0.95 µm resolution open tube, dual oblique viewing angles, and the intuitive Gensys® inspection software, Jade Plus transforms image clarity into measurable insight.
From microcrack detection in passives to void analysis in BGA solder balls, Jade Plus goes beyond visual inspection by turning images into actionable, standards-compliant data. Optional µCT 3D visualization adds even deeper insights, making Jade Plus an ideal system for both production environments and failure analysis labs.
Key Features
- 0.95 µm resolution for micro-defect recognition
- Open transmissive X-ray tube with replaceable tungsten filament
- Gensys® point-and-click software – no joystick required
- Automated inspection routines for fast batch inspection
- BGA void analysis, bump roundness, and through-hole fill measurement
- 2× oblique viewing angles (65°) for true 360° inspection
- Component Location feature for fast part navigation
- Optional µCT accessory for 3D visualization of solder joints
- Maintenance-friendly design for easy filament changes
- Training included with every system for safe operation and confidence
Specification
| Feature | Specification |
|---|---|
| Tube Technology | Open transmissive, tungsten filament |
| Feature Recognition | 0.95 µm |
| Tube Target Power | 3 W |
| Voltage Range | 30 – 160 kV |
| Detector | AspireFP™ Flat Panel |
| Resolution | 1.33 MP |
| Frame Rate | 10 fps |
| Image Processing | 16-bit digital |
| Software | Gensys® (Windows 10) |
| Operation | Point-and-click (joystick optional) |
| Oblique Angle View | 2 × 65°, 360° rotation |
| Inspection Area | 510 × 445 mm (20 × 17.5") |
| Magnification | Up to 7,500× |
| Display | 24" WUXGA (1920 × 1200) |
| Footprint (W × D × H) | 1.45 × 1.70 × 1.97 m |
| System Weight | 1,950 kg (4,300 lbs) |
| Air Supply | Not required |
| X-ray Safety | < 1 µSv/hour (compliant with global standards) |
Applications
Electronics & PCB Assembly
- Defect detection in BGAs, QFNs, and solder joints
- Screening for solder pad issues, voids, and bridging
- Quality control in production and rework environments
Semiconductors & Microelectronics
- Inspection of passives, µ-BGAs, and flip-chip assemblies
- Identification of micro-cracks, cold joints, and misalignments
- Metrology of bump geometry, roundness, and ball integrity
Resources
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