Advanced Multi-Angle Reflectometry and Ellipsometry
Product Overview
The FilmTek™ 6000 PAR-SE Robotic is a cutting-edge metrology system designed for precise, non-contact measurement of thin films and multi-layer stacks in semiconductor manufacturing. By integrating Multi-Angle Differential Polarimetry (MADP) and Differential Power Spectral Density (DPSD) technologies, this system independently measures film thickness and refractive index with exceptional sensitivity. It is particularly adept at analyzing ultra-thin and complex multi-layer films, making it an invaluable tool for advanced semiconductor device fabrication.
Key Features
- Independent Measurement of Film Parameters: Utilizes MADP and DPSD technologies to separately determine film thickness and refractive index, enhancing measurement accuracy.
- Broad Spectral Range: Covers wavelengths from 190 nm to 1700 nm, accommodating a wide variety of materials and applications.
- High Precision for Ultra-Thin Films: Achieves repeatability of 0.03 Å on native oxide, ideal for ultra-thin film measurements.
- Small Measurement Spot Size: Features a 50 µm spot size enabled by patented parabolic mirror technology, allowing analysis within small device features.
- Automated Wafer Handling: Supports cassette-to-cassette wafer handling with compatibility for FOUP or SMIF systems, enhancing throughput and integration into production lines.
- Advanced Material Modeling Software: Incorporates Bruker's generalized material model with advanced global optimization algorithms for comprehensive data analysis.
- SECS/GEM Compatibility: Ensures seamless communication with factory host systems for efficient data management and process control.
Specifications
| Specification | Details |
|---|---|
| Film Thickness Range | 0 Å to 150 µm |
| Film Thickness Accuracy | ±1.0 Å for NIST traceable standard oxide 100 Å to 1 µm |
| Spectral Range | 190 nm to 1700 nm (220 nm to 1000 nm is standard) |
| Measurement Spot Size | 50 µm |
| Sample Size | 2 mm to 300 mm (150 mm standard) |
| Spectral Resolution | 0.3 nm to 2 nm |
| Light Source | Regulated deuterium-halogen lamp (2,000 hrs lifetime) |
| Detector Type | 2048 pixel Sony linear CCD array / 512 pixel cooled Hamamatsu InGaAs CCD array (NIR) |
| Computer | Multi-core processor with Windows™ 10 Operating System |
| Measurement Time | ~2 seconds per site (e.g., oxide film) |
Applications
Front-End Semiconductor Manufacturing
The FilmTek 6000 PAR-SE Robotic excels in performing fast, accurate, and repeatable multi-layer film thickness and refractive index measurements on patterned device wafers. It supports process control for a wide range of materials
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