Precision Stereo Microscopy for Semiconductor & Electronics Inspection
Product Overview
The Evident DP75 is a versatile, high-resolution digital microscope camera designed for brightfield, fluorescence, and infrared imaging in life sciences, semiconductor, electronics, and industrial applications. With a high-sensitivity, cooled CMOS sensor and an innovative switchable infrared (IR) cut filter, the DP75 eliminates the need for multiple cameras, allowing users to capture both color and monochrome images with exceptional clarity.
Featuring TruAI™ denoising technology, pixel-shifting for ultra-high resolution, and AI-based auto-scene recognition, the DP75 simplifies microscopy workflows while delivering publication-quality images. With its fast frame rate of 22 fps at 4K and 60 fps at Full HD, it ensures smooth live imaging for dynamic sample observation.
Key Features
- High-Sensitivity Cooled CMOS Sensor – Reduces noise and enhances fluorescence imaging.
- Switchable IR Cut Filter – Captures fluorescence up to 1000 nm and supports infrared imaging.
- Pixel-Shift Technology – Achieves ultra-high-resolution images up to 8192 × 6000 pixels.
- TruAI™ Real-Time Denoising – Improves clarity and signal-to-noise ratio for fluorescence imaging.
- Fast Frame Rate – 22 fps at 4K resolution, 60 fps at Full HD for smooth live imaging.
- AI-Based Auto Scene Recognition – Automatically detects observation modes (brightfield, fluorescence, DIC, polarization, phase contrast).
- Wide Dynamic Range Imaging – High color fidelity and exceptional contrast for all microscopy applications.
- Instant Multiple Image Alignment (MIA) – Creates wide-area images manually without motorized stages.
- Quantitative Fluorescence Analysis – Linear mode provides accurate intensity measurement.
- Seamless Integration – Compatible with Evident cellSens and DP2-TWAIN software for advanced image processing.
Specifications
| Feature | Specification |
|---|---|
| Camera Type | Single-Chip Color CMOS with Pixel Shift |
| Cooling System | Peltier Device (Active Cooling) |
| Sensor Size | 1.1-inch, 12.37-MP CMOS, Global Shutter |
| Effective Image Resolution | 8192 × 6000 (Pixel Shift), 4096 × 3000 (3CMOS Mode), 2048 × 1500 (2 × 2), 1920 × 1080 (1 × 1) |
| Frame Rate | 22 fps (4K), 60 fps (Full HD), 44 fps (2048 × 1500, 1 × 1) |
| Sensitivity | ISO 100–3200 Equivalent (1X to 32X Gain) |
| Infrared Cut Filter | Switchable (400–650 nm / 400–1000 nm) |
| AI Scene Recognition | Auto-detects brightfield, fluorescence, phase contrast, DIC, polarization |
| Multiple Image Alignment (MIA) | Available (Supports Fluorescence & Brightfield) |
| Linear Mode for Fluorescence Intensity | Yes |
| Binning | 2 × 2 |
| Exposure Time | 28 µs – 120 s |
| Data Interface | USB 3.1 Gen2 (Compatible with Windows 10/11 Pro 64-bit) |
| Supported Software | cellSens, DP2-TWAIN (v10.5 or later) |
| Camera Dimensions | 118.6 mm (L) × 116 mm (Ø), Weight: 1.4 kg |
Applications
- Wafer & IC Chip Inspection – Capture high-resolution images of defects, contamination, and surface topology.
- PCB & Solder Joint Analysis – Enhance defect detection in microelectronics and circuit board inspection.
- Infrared Imaging for Semiconductor Layers – Visualize buried structures in silicon wafers and MEMS devices.
- Material & Coating Analysis – Evaluate wear-resistant coatings and composite material defects.
- Failure Analysis & Fractography – Inspect turbine blades, metallic components, and fatigue fractures.
- Infrared & Multispectral Imaging – Analyze thermal properties of aerospace materials.
- Microstructure & Weld Inspection – Assess grain structure, spot welds, and mechanical fatigue.
- Coating Thickness Measurement – Analyze protective coatings, plating, and corrosion resistance layers.
- High-Speed Motion Analysis – Capture dynamic structural behavior in material stress testing.
Resources
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