Stylus Profiler

Dektak Pro Stylus Profiler

Product Overview

The Dektak Pro is an industry-leading stylus profiler designed for high-precision surface metrology. This 11th-generation Dektak system offers exceptional accuracy, ease of use, and enhanced versatility for film thickness, step height, surface roughness, stress, and wafer bow measurements.

With its 4Å repeatability, advanced LIS 3 low-inertia sensor, and automated scanning capabilities, the Dektak Pro is the ideal solution for microelectronics, thick film coatings, and life sciences applications.

 

Key Features

  • High-Resolution Profiling – Achieves 4Å step height repeatability for precise measurements.
  • Fast & Accurate Data Collection – Direct-drive scan stage technology ensures fast scanning with minimal noise.
  • User-Friendly Software – Vision64® with intuitive GUI, automated multi-scan analysis, and 64-bit parallel processing.
  • Versatile Measurement Options – Supports 2D surface profiling, 3D stress mapping, and wafer warpage analysis.
  • Wide Stylus Range – Choose from 50nm to 25μm radius tips for different applications.
  • Automated & Manual Configurations – Available in 100mm (manual), 150mm (automated), and 200mm (automated encoded) stages.
  • Low Force Option for Delicate Samples – N-Lite+ low force sensor (0.03 mg to 15 mg) ensures precise analysis of soft materials.

 

Specifications

Feature Specification
Measurement Technique Stylus Profilometry (Contact Measurement)
Scan Length Range 55 mm (2") – 200 mm (8") with scan stitching
Step Height Repeatability 4Å (1 sigma) on ≤1µm steps
Stylus Sensor LIS 3 Low-Inertia Sensor
Stylus Force Range 1 mg to 15 mg (0.03 mg with N-Lite+ option)
Stylus Tip Options 50 nm to 25 μm (various tip radii available)
Sample Stage Sizes 100mm (manual), 150mm (automated), 200mm (automated encoded)
Wafer Compatibility Up to 200mm (8") wafers
Vibration Isolation Optional isolation table & vacuum pads
Software Interface Vision64® with automated multi-scan analysis
Input Power 100-240V AC, 50/60Hz
Operating Temperature 20-25°C (68-77°F)
System Dimensions 455 mm (W) x 550 mm (D) x 370 mm (H), 34 kg

 

 

Applications

  • Microelectronics & Semiconductors – Deposition monitoring, trench depth measurement, sensor height evaluation.
  • Thick Film Coatings – Hard coatings, decorative coatings, ink/pigment film thickness.
  • Wafer-Level Testing – Wafer bow mapping, stress evaluation, and surface uniformity analysis.
  • Medical & Life Sciences – Biomaterial thickness measurement, bio-sensor characterization, and microfluidic channel analysis.
  • R&D & Industrial Quality Control –Process development, step height verification, and roughness analysis.
Talk to us

Please complete the form and we will be in contact as soon as possible.

How can we help you?

CAPTCHA