3D Optical Profilometer
Product Overview
The ContourX-1000 is a fully automated, floor-standing white light interferometry (WLI) system designed for high-precision, non-contact 3D surface metrology. Engineered with cutting-edge innovations like Advanced Find Surface™, Universal Scanning Interferometry (USI), and self-calibrating laser technology, the ContourX-1000 delivers nanometer-level resolution on the most complex surfaces with unmatched ease and reliability.
Whether in semiconductor fabs, R&D labs, or high-volume production lines, this system provides ultra-fast, accurate, and operator-independent profiling for a wide range of materials and surface structures — from MEMS and optics to technical polymers and wafer-level components.
Key Features
- Self-Calibrating System: Ensures extreme accuracy with internal laser reference and integrated vibration isolation.
- Advanced Find Surface™: One-click surface detection with auto-focus and illumination for faster workflows.
- Universal Scanning Interferometry (USI): Self-adapting measurement mode maintains nanometer resolution across variable topographies.
- Automated Tip/Tilt & Stages: ±5° tip/tilt and 300 mm XY automated stage simplify complex surface scanning.
- High-Throughput Performance: Supports high-speed scanning up to 122 μm/sec for production-floor applications.
- Powerful Software Suite: Vision64®, VisionXpress™, SureVision, and other modules for customized analysis and reporting.
- Flexible Objective & Lighting Options: Dual-LED illumination, interchangeable objectives, and motorized turret for optimized imaging.
Specifications
| Feature | Specification |
|---|---|
| Measurement Modes | PSI, USI, VSI, Optional Film |
| Vertical Resolution | <0.01 nm |
| Max. Scan Range | ≤10 mm |
| Step Height Accuracy / Repeatability | <0.75% / <0.125% 1σ |
| Lateral Resolution | 0.38 μm (Sparrow); 0.13 μm (with AcuityXR®) |
| Scan Speed | ≤122 μm/sec |
| Max. Sample Slope | ≤40° (shiny), ≤87° (rough) |
| Max. Sample Height / Weight | 100 mm / 45 kg |
| XY Sample Stage | 300 mm automated with 0.5 µm encoders |
| Z Focusing Range | 100 mm automated |
| Objectives | 1X–115X, Parfocal/LWD/TTM/Bright Field options |
| Camera | 5 MP mono (optional color), 1200 × 1000 array |
| Software Platform | Vision64®, VisionXpress™ (Windows 10 LTS 64-bit) |
| Automation Features | Auto-focus, Auto-stitching, Auto-saving, Pattern alignment |
| Calibration | NIST/PTB traceable, optional continuous auto calibration |
| System Footprint (WxDxH) | 852 × 793 × 1608 mm |
| Weight | 493 kg |
| Certifications | CE, ANSI B46.1 compliant |
Applications
- Wafer-level surface profiling
- MEMS device structure measurement
- Thin film metrology
- TSV and bump inspection
Resources
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