High-Throughput 3D Optical Profilometer for Large PCB Panels
Product Overview
The ContourSP is a purpose-built, high-performance 3D optical metrology system engineered for large-format PCB, HDI, and MCM panel inspection. Designed to meet the increasing demands for accuracy and throughput in advanced electronics manufacturing, the ContourSP provides non-contact, nanometer-level surface characterization across substrates up to 600 x 600 mm.
Featuring Bruker’s patented Wyko® Vertical Scanning Interferometry (VSI) and enhanced with advanced features like Dynamic Signal Segmentation (DSS), re-measure functionality, and topography compensation, the ContourSP ensures maximum yield, uptime, and cost-efficiency in high-volume production environments.
Key Features
- Gage-capable 3D optical measurements with sub-nanometer vertical resolution
- Large-format stage supporting panels up to 600 x 600 mm
- High-speed scanning – more than 2× faster than previous generation systems
- Dynamic Signal Segmentation (DSS) for accurate via inspection even with fiber layer interference
- Recipe portability for multi-factory tool matching and scalability
- Vision64® software with pass/fail analysis, full databasing, and access control
- Quick-release, motorized 5-position turret with automatic objective sensing
- Remeasure and auto-alignment functions for increased repeatability and throughput
Specifications
| Specification | Details |
|---|---|
| Measurement Method | Non-contact vertical scanning interferometry (VSI) |
| Vertical Resolution | <0.1 nm |
| Repeatability (RMS) | 0.01 nm |
| Vertical Measurement Range | 0.1 nm to 10 mm |
| Lateral Resolution | 0.55 μm min (Sparrow Criterion) |
| Field of View | 10.8 mm x 8.1 mm (max); up to full panel via stitching |
| Stage Size | 600 mm x 600 mm automated |
| Panel Types Supported | All PCB substrates including CZ, SR, ABF, thick film, and fiber-reinforced |
| Step Height Accuracy | 0.6%; <0.1% at 1σ repeatability |
| Scan Speed | Up to 80 μm/sec |
| Camera Options | High-resolution digital array; 80 fps standard; 60 fps large format |
| Objectives | 2.5X to 50X; zoom lenses: 0.55X to 2X |
| Software | Vision64®, MATLAB®, SureVision, FixSure™, TCP/IP interface |
| Advanced Features | DSS, topography scanning, remeasure, auto-align, ESD-safe options |
| System Construction | Granite base, stainless-steel soundproof enclosure, R/Y/G status tower |
| Footprint (W x D x H) | 115 cm x 143 cm x 163 cm (45 in x 56 in x 64 in) |
Applications
PCB & Electronics Manufacturing
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Multi-layer PCB analysis, trace width/spacing measurement
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Build-up, dielectric, and copper layer height
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Solder mask and pad opening validation
Semiconductors & HDI Panels
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Via dimension and depth analysis with fiber-layer compensation
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Surface roughness analysis down to sub-nanometer scale
Advanced Materials & Packaging
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Dimple/recess feature characterization
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Overlay, pad clearance, and anchor measurement for IC packaging
Resources
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