Bondtester 4000 Plus

The 4000 Plus BondTester is the ultimate solution for high-precision bonding inspection in semiconductor, electronics, and other critical industries. Designed for fast, reliable, and highly accurate bond quality testing, the 4000 Plus is ideal for evaluating the integrity of wire bonds, flip-chip connections, and other bonded components. With its advanced ultrasonic, mechanical, and electrical testing capabilities, the 4000 Plus ensures that your bonds meet the highest standards of reliability and performance.

This cutting-edge system offers automated, high-throughput testing for a wide range of applications. Whether you're performing quality control on semiconductor packaging, automotive electronics, or medical devices, the 4000 Plus BondTester guarantees the detection of the smallest bond-related defects, from cracks and voids to weak joints that may jeopardize the product's functionality and lifespan.

Key Features

• Multimodal Testing: Supports a variety of testing methods, including mechanical, electrical, and ultrasonic, to provide a comprehensive bond integrity analysis.
• High-Resolution Inspection: The system offers exceptional sensitivity, detecting even the most subtle bond issues down to the micron level.
• High Throughput: Capable of performing rapid testing without compromising on accuracy, ensuring a quick turnaround for large production volumes.
• User-Friendly Interface: Easy-to-navigate software with a touch-screen interface and customizable settings for efficient operation.
• Data Traceability: All test results are automatically recorded and saved with complete traceability, ensuring compliance with quality standards and regulations.

Applications

• Ribbon pull – With an extensive range of load tools including hooks and tweezer jaws, all sizes and types of ribbons can be tested.
• Hot bump/pin pull – A new load cartridge makes this groundbreaking test even better, especially for evaluating PCB substrate materials and low profile solder bumps.
• First bond ball pull of copper wires and pull of studs, bumps and pillars – For the first time custom pull jaws enable tensile tests on these important interconnects. 
• Passivation layer shear – A combination of software and a special load tool provides a solution to ball shear where access is limited by the passivation layer.