Flexible, High-Performance Plasma Cleaning and Surface Activation
Product Overview
The AP Batch Series, including the AP-600 and AP-1000, delivers high-throughput plasma surface treatment in compact, configurable systems designed for semiconductor, electronics, and medical device manufacturing. These batch systems offer exceptional uniformity, repeatability, and process control, allowing for plasma cleaning, surface activation, and adhesion enhancement across various substrates and packaging formats.
While the AP-600 is ideal for R&D labs and low-to-medium volume production, the AP-1000 provides robust capacity and extended automation for high-volume applications. Both models feature touchscreen interfaces, configurable shelving, and compatibility with multiple gases for treatment versatility.
Key Features
- Uniform plasma treatment with 13.56 MHz RF generator and impedance matching
- Flexible shelf architecture for magazines, trays, wafers, and Auer® boats
- Durable construction: stainless steel chamber (AP-1000) or aluminum (AP-600)
- Touchscreen control panel with EPC software and real-time monitoring
- Remote interface options: PlasmaLINK, ProcessLINK, SECS/GEM
- Support for multiple gases: argon, nitrogen, oxygen, helium, fluorinated gases
- High-throughput capability for batch production
- Compact footprint with front-access maintenance
- SEMI S2/S8 and CE compliant for global manufacturing standards
- Optional purged dry pump and gas generators for enhanced control
Specifications
| Specification | AP-600 | AP-1000 |
|---|---|---|
| Chamber Volume | 50.4 liters (3076 in³) | 127 liters (7774 in³) |
| Electrode Positions | 7 | 14 |
| Working Area (Powered) | 330 × 330 mm (13 × 13 in.) | 349 × 425 mm (13.74 × 16.73 in.) |
| Standard RF Power | 600 W | 600 W (up to 1000 W with 50.8 mm pitch) |
| Frequency | 13.56 MHz | 13.56 MHz |
| Gas Flow Options | 10–500 sccm | 100–1000 sccm |
| Max Number of Mass Flow Controllers (MFCs) | 3 | 3 |
| Dimensions (W × D × H) | 569 × 869 × 704 mm | 680 × 1127 × 1890 mm |
| Net Weight | 221 kg (487 lbs) | 485 kg (1069 lbs) |
| Vacuum Pump | Wet (19.5 cfm) / Optional dry (22 cfm) | Wet (53 cfm) / Optional dry (63 cfm) |
| Power Supply | 110/220 V, single-phase | 220/380 V, 3-phase |
| Software Interface | EPC touchscreen with remote connectivity | EPC touchscreen with SECS/GEM, PlasmaLINK |
| Compliance | SEMI S2/S8, CE | SEMI S2/S8, CE |
| Typical Gases Supported | Argon, O₂, N₂, He, fluorinated gases | Argon, N₂, He |
Applications
Semiconductors & Advanced Packaging
- Plasma cleaning of lead frames and IC packaging
- Surface activation for improved die attach and bonding
- Residue removal from wafers and substrates
Electronics Manufacturing
- Surface treatment of PCBs, components, and interposers
- Plasma cleaning before wire bonding or coating
- Activation for conformal coating and encapsulation
Resources
Download AP600 Series Brochures
Please complete the form and we will be in contact as soon as possible.