Precision, Automation, and Repeatability for Advanced Bond Testing
The 4600-W Automated Bondtester is a benchtop system designed to automatically perform complex test procedures without operator input. It can automatically complete shear and pull test patterns with different orientations of bonds, while recording failure mode images upon completion.
Key Features
- Fully Automated Testing: Performs shear and pull tests without operator intervention.
- Camera-Assisted Fiducial Recognition: Ensures precise alignment and testing.
- Wafer Map Import: Supports Sinf, Klarf, and G85 formats.
- Wafer ID Reading: Utilizes Optical Character Recognition (OCR) for traceability.
- Compound Surface Imaging (CSI): Provides detailed topology information with autofocus.
- Automatic Grading Assistance: Includes area calculation for efficient analysis.
- High Precision: Offers step back accuracy of ±0.25 μm and system accuracy ranging from ±0.10% to 0.05% FSL.
- Multi-Functional Cartridge: Combines shear and pull transducers for versatile testing.
- Paragon™ Automation Software: Features an automation-assisted GUI with built-in checklists, multi-window views, and schematic virtual images.
Specifications
| Feature | Specification |
|---|---|
| Automation | Camera-assisted fiducial recognition |
| Wafer Map Import | Sinf, Klarf, G85 |
| Wafer ID Reading | OCR |
| Sample Handling | Wafer |
| Light Tower System | Included as standard |
| Topology Information | Compound Surface Imaging (CSI) + autofocus |
| Grading Assistance | Automatic area calculation upgrade |
| Step Back Accuracy | ±0.25 μm |
| System Accuracy | ±0.10% - 0.05% FSL |
| Multi-Functional Cartridge | Combinations of shear and pull transducers |
| Stage and Resolution | 100 nm Renishaw linear encoders |
| X, Y Travel | 450 mm X, 410 mm Y |
| X, Y Speed and Force | 50 mm/s at 20 kg or 30 mm/s at 50 kg |
| Z Travel and Resolution | 75 mm, 5 mm/s |
| Z Speed and Force | 5 mm/s, up to 50 kg |
| Footprint (W x D x H) | 1075 mm x 920 mm x 1000 mm |
| Weight | 140 kg |
| Power Supply | 90-264 V, AC Single phase |
| Pneumatic Supply | 4 Bar, 6 mm OD / 4 mm ID plastic pipe |
| Vacuum Supply | Minimum 500 mm Hg plastic pipe |
Applications
Semiconductors
- Automated testing of wire bonds, ball bonds, and die shear on wafers up to 200 mm.
- Ensures reliability and throughput in semiconductor manufacturing processes.
Electrical & Electronics
- Evaluates mechanical strength of intercell connections, including wire bonds, ribbons, busbars, and tab welds.
- Suitable for both destructive and non-destructive testing modes to ensure safety and performance.
Resources
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