Precision, Automation, and Repeatability for Advanced Bond Testing
The 4600 Series Automated Bondtesters represent the next generation in mechanical reliability testing. Designed for high-throughput environments in semiconductor, battery, and electronics industries, the 4600 Series offers full automation, exceptional data integrity, and system-to-system correlation. Operators are no longer required to control every step—these bondtesters automatically align, test, image, and record failure modes with unmatched precision and repeatability.
Equipped with Nordson’s multi-function test cartridges, SXI imaging, and Paragon™ software, the system delivers reproducible results for wire pull, shear, die shear, bump pull, and more—meeting global standards such as MIL-STD, IPC, and JEDEC.
Key Features
- Fully automated testing with robotic sample handling and alignment
- Supports wire pull, ball shear, die shear, bump pull, and more
- Multi-function cartridge (MFC) for flexible test switching
- High-speed XY travel (up to 70 mm/s) with 100 nm resolution
- Closed-loop motion system ensures ±0.25 µm accuracy
- Camera-assisted alignment and SXI imaging for failure detection
- Automatic failure mode ID, barcode scanning, and test pattern import
- Compatible with wafers up to 8", lead frames, substrates, and strips
- Full traceability with factory integration via SECS/GEM & RS-232
- Operator-friendly Paragon™ software for intuitive programming
Specifications
| Feature | Specification |
|---|---|
| Test Modes | Pull, shear, bump, die shear, SMD shear |
| Force Range | 0.01 gf to 50 kgf |
| Cartridge System | Multi-function cartridge (MFC) |
| Imaging System | Autofocus with Compound Surface Imaging (CSI) |
| Failure Mode Detection | Automatic with wire detection |
| Sample Handling | Wafer + strip auto-load |
| Traceability | Wafer OCR + barcode strip ID |
| XY Travel Range | 450 mm × 410 mm |
| Z Travel Range | 75 mm |
| XY Speed / Resolution | Up to 70 mm/s, 100 nm |
| Z Speed / Resolution | 5 mm/s, 250 nm |
| System Accuracy | ±0.10% – 0.05% FSL |
| Step-Back Accuracy | ±0.25 µm |
| Footprint (W × D × H) | 1075 mm × 920 mm × 1000 mm |
| Weight | 140 kg |
| Power Supply | 90–264 V, single phase |
| Pneumatic Supply | Min. 4.0 Bar |
| Vacuum Supply | Min. 500 mm Hg (4600-W only) |
Applications
Semiconductors
- Pull and shear tests for wire bonds, µ-pillar bumps, solder balls, and die attach
- High-resolution testing for wafer-level packaging (WLP), SiP, and MEMS
- Automated, repeatable validation of test wafers (2"–8") and lead frames
- Conformance to MIL-STD-883, JEDEC JESD22, and IPC-TM standards
Electrical & Electronics
- Quality assurance testing for BGA, CSP, and SMD components
- Mechanical bond validation in high-density PCBs and interconnects
- Testing of fine-pitch wire/ribbon interconnects on consumer and automotive electronics
Resources
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