The 31st edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2024), set against the stunning backdrop of Marina Bay Sands Convention Center in the heart of Singapore.

15-18th July 2024
Marina Bay Sands Expo and Convention Centre, Singapore

Ladies and gentlemen, distinguished guests, and esteemed colleagues, a warm greeting to the 31st edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2024), set against the stunning backdrop of Marina Bay Sands Convention Center in the heart of Singapore! As we embark on this next chapter of the IPFA legacy, we find ourselves in a city synonymous with innovation and technological marvels. Singapore’s iconic skyline mirrors the heights of excellence we aim to achieve in our exploration of the physical and failure analysis of integrated circuits. This symposium remains dedicated to fostering collaboration and knowledge exchange among the brightest minds in the field. The discussions and insights shared here will undoubtedly contribute to the ever-evolving landscape of integrated circuit analysis and design.

In addition, for the first time, IPFA will be co-located with the International ESD Workshop (IEW-Asia 2024). This is a unique opportunity for both communities to reach out to a wider audience! Prospective authors and attendees may visit the IEW-Asia 2024 website.

We are looking forward to welcoming you to a memorable experience!

Highlights from 2023

 
 

Our Location

 Crest Innovation (S) Pte. Ltd. Booth at the IPFA 2024 Exhibition

 

 

Keynote Speakers

Dr. Julien Ryckaert, imec, Belgium

Dr. Julien Ryckaert, imec, Belgium

Compute scaling beyond the finFET era: the road to CMOS 2.0

Dr-Yeo-Yee-Chia

Dr. Yeo Yee-Chia, Agency for Science, Technology, and Research (A*STAR), Singapore

Enabling Next-Generation Heterogeneously Integrated Computing Systems Incorporating Photonics

Tutorial Speakers

Dr. Jim Vickers,

Dr. Jim Vickers, Thermofisher Scientific, USA

Three decades of IC-Probing Technology: The Great Loop from E-beam Methods to Optical Methods and back to E-beam Methods

Dr. Michael Khazhinsky

Dr. Michael Khazhinsky, Silicon Labs, USA

ESD and Latch-up Design Verification. How Electronic Design Automation (EDA) Helps to Avoid and Solve Product Problems

Dr. Yan Li

Dr. Yan Li, Samsung Semiconductor Inc., USA

Advanced Packaging technologies for chiplet and memory integration

Dr. Sebastian Brand

Dr. Sebastian Brand, Fraunhofer IWMS, Germany

Exploring High-Resolution Non-Destructive Defect Localization and Signal Processing Advances in Microelectronics Failure Analysis

Professor Cristian Zambelli

Professor Cristian Zambelli, University of Ferrara, Italy

A cross-layer assessment of Emerging memories reliability

Professor Fei Hui

Professor Fei Hui, Zhengzhou University, China

Reliability study of 2D material and its-based memory devices for future technology nodes

Professor Michel Bosman

Professor Michel Bosman, National University of Singapore, Singapore

The relevance of Aberration-Corrected STEM for IC Failure Analysis

Professor Enrico Zanoni

Professor Enrico Zanoni, University of Padova, Italy

GaN devices, technology, characterization, reliability challenges and future prospects

Invited Speakers

Dr. Michael Khazhinsky, Silicon Labs, USA

Dr. Michael Khazhinsky, Silicon Labs, USA

ESD and Latch-up Design Verification Challenges in Packaged Parts and Modules

Dr. Sebastian Brand, Fraunhofer IWMS, Germany

Dr. Sebastian Brand, Fraunhofer IWMS, Germany

Advances in high-resolution non-destructive defect detection and localization enhanced by intelligent signal processing

Dr. Shahin Tajik

Dr. Shahin Tajik, Worcester Polytechnic Institute, USA

Securing Hardware against Physical Adversaries with Unlimited Resources

Dr. Yan Li, Samsung Semiconductor Inc., USA

Dr. Yan Li, Samsung Semiconductor Inc., USA

The Applications of Simulation and Artificial Intelligence in Advanced Packaging

Professor Fei Hui, Zhengzhou University, China

Professor Fei Hui, Zhengzhou University, China

In-situ observation of reliable nanosynpatic response in low-dimensional materials using CAFM

Jayant D’Souza, Siemens, USA

Jayant D’Souza, Siemens, USA

Increasing chain diagnosis resolution in the age of backside power

Professor Enrico Zanoni, University of Padova, Italy

Professor Enrico Zanoni, University of Padova, Italy

Mechanisms of charge capture and emission in power GaN HEMTs

Professor Cristian Zambelli, University of Ferrara, Italy

Professor Cristian Zambelli, University of Ferrara, Italy

3D NAND Flash memories reliability: a cross-layer perspective

Join us at booth A11 for a live experience

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